Exhibitor Detail
Last modified: 2025/08/04
HERRMANN ULTRASONIC JAPAN CORPORATION
www.herrmannultrasonic.co.jp- 5-126EAST Hall 5
- Exhibition theme
-
Supporting a Sustainable Society
- Exhibition classification
-
- Packaging-related equipment
Products Information
Top Seal Module (TSM)
The PACKLINE modules from Herrmann achieve strong and hermetic sealing. Burns caused to the packaging material during machine downtimes are safely prevented. The top seal module is optimally suited for integration in new machinery or as retrofit for existing machine designs. If the tools are designed with protection class IP65/67, the top seal module is also suitable for use in wet environments with advanced cleaning capability requirements.
Exhibitor Profile
- Address
-
〒2778519 柏市若柴178番地4柏の葉キャンパス148街区2 KOIL506
- Contacts
-
telephone number 0471998975